Wearable and implantable Circuits and Systems for real-time Seizure Detections, Seizure Predictions, and closed-loop methods for seizure suppression in epilepsy
Epilepsy is one of the most common neurological disorder. About 65 million people in the world are affected. Traditional treatments includes antiepileptic drugs or using resection surgery to remove the epileptogenic zone. Many patients still suffer seizures occasionally with above treatments. In recent years, alternative treatments and devices are proposed to investigate and treat epilepsy in addition to pharmacological and surgical treatments. Several prosthesis devices with deep brain stimulation (DBS) or vagus nerve stimulation are becoming popular treatments for epilepsy clients. In this tutorial, real-time methods for seizure detections, seizure predictions and many closed-loop method for seizure suppression in epilepsy will be reviewed and discussed. This tutorial will further focused on above methods that have been verified in circuits and systems that has silicon fabricated or system prototypes for either wearable and implantable devices.
Circuits and Systems for Next-Generation Ultrasound Imaging Devices
Ultrasound imaging is a safe and cost-effective technique for the diagnosis of a wide variety of medical conditions, and for the guidance of treatment. Today, the vast majority of ultrasound scans is made by a trained healthcare professional operating a hand-held probe connected to an imaging system. However, a next generation of smaller and “smarter” ultrasound imaging devices is emerging. Examples include catheters that provide real-time 3D imaging to guide minimally-invasive interventions, and wearable ultrasound devices used by the patient at home for new monitoring and diagnostic applications. Innovations in circuits and systems play an crucial role in realizing these next-generation ultrasound imaging devices, and will be the focus of this tutorial.
The tutorial will start by reviewing of the basics of ultrasound imaging and the architecture of conventional imaging systems. We will highlight the significant changes in system architecture needed to move towards miniatured and wearable 3D imaging devices. Close integration of transducers and integrated circuits is an important enabler for this. Front-end electronics integrated close to the transducer elements can provide local high-voltage pulsing, echo-signal amplification, channel-count reduction, and digitization, paving the way towards probes with fully-digital interfaces that no longer rely on wired connections to an imaging system. The tutorial will illustrate the potential of in-probe electronics by means of examples of state-of-the-art designs featuring transducer-on-CMOS integration and pitch-matched circuits for high-voltage pulsing, beamforming and digitization.